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cystech electronics corp. spec. no. : c416n8j issued date : 2017.01.09 revised date : age no. : 1/13 MTC3585N8J cystek product specification n- and p-channel enhancement mode mosfet MTC3585N8J n-ch p-ch bv dss 20v -20v i d @v gs =4.5v(-4.5v), t a =25 c 5.5a -3.5a i d @v gs =4.5v(-4.5v), t c =25 c 8.0a -5.1a r dson @v gs =4.5v(-4.5v) typ. 20.5m 60.1m r dson @v gs =2.5v(-2.5v) typ. 24.5m 79.4m features ? simple drive requirement ? low on-resistance ? fast switching speed ? pb-free lead plating and halogen-free package equivalent circuit outline ordering information device package shipping MTC3585N8J-0-t1-g 2928-8j (pb-free lead plating and halogen-free package) 3000 pcs / tape & reel MTC3585N8J 2928-8j pin 1 g gate s source d drain environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t1 : 3000 pcs / tape & reel,7? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c416n8j issued date : 2017.01.09 revised date : age no. : 2/13 MTC3585N8J cystek product specification absolute maximum ratings (t c =25 c, unless otherwise noted) limits parameter symbol n-channel p-channel unit drain-source breakdown voltage bv dss 20 -20 gate-source voltage v gs 8 8 v t a =25 c, v gs =4.5v (-4.5v) 5.5 -3.5 continuous drain current *2 t a =70 c, v gs =4.5v (-4.5v) i dsm 4.4 -2.8 t c =25 c, v gs =4.5v (-4.5v) 8.0 -5.1 continuous drain current t c =100 c, v gs =4.5v (-4.5v) i d 5.1 -3.1 pulsed drain current * 3 i dm 30 -20 a t a =25 c, single device operation 1.5 *2 t a =70 c, single device operation 0.96 *2 t a =25 c, single device value at dual operation 1.24 *2 t a =70 c, single device value at dual operation p dsm 0.79 *2 t c =25 c 3.75 total power dissipation t c =100 c p d * 1 1.88 w operating junction and storage te mperature range tj; tstg -55~+175 c thermal data parameter symbol value unit max. thermal resistance, junction-to-ambient, single device operation 84 *2 max. thermal resistance, junction-to-amb ient, single device value at dual operation r th,j-a 101 *2 max. thermal resistance, junction-to-case r th,j-c 40 c/w note : 1 . the power dissipation p d is based on t j(max) =175 c, using junction-to-case thermal resistance, and is more useful in setting the upper di ssipation limit for cases where additional heatsinking is used. 2 . the value of r ja is measured with the device mounted on 1 in 2fr-4 board with 2 oz. copper, in a still air environment with t a =25 c, t 5s . 216 c/w when mounted on a minimum pad of 2 oz. copper. the power dissipation p dsm is based on r ja and the maximum allowed junction temperature of 150 c. the value in any given application depends on the user?s specific board design. 3. pulse width limited by junction temperature t j(max) =175 c. ratings are based on low duty cycles to keep initial t j =25 c. n-channel electrical characteristics (tc=25 c, unless otherwise specified) symbol min. typ. max. unit test conditions static bv dss 20 - - v gs =0v, i d =250 a v gs(th) 0.5 - 1.2 v v ds =v gs , i d =250 a i gss - - 100 na v gs =8v, v ds =0v - - 1 v ds =20v, v gs =0v i dss - - 10 a v ds =16v, v gs =0v, tj=70 c - 20.5 29 v gs =4.5v, i d =3.5a *r ds(on) - 24.5 49 m v gs =2.5v, i d =1.2a *g fs - 5 - s v ds =10v, i d =1a
cystech electronics corp. spec. no. : c416n8j issued date : 2017.01.09 revised date : age no. : 3/13 MTC3585N8J cystek product specification dynamic ciss - 420 - coss - 48 - crss - 48 - pf v ds =10v , v gs =0v , f=1mhz *t d(on) - 2.8 - *t r - 16.6 - *t d(off) - 30.8 - *t f - 3.6 - ns v ds =10v , i d =3.5a , v gs =4.5v , r g =1 *qg - 6.6 - *qgs - 0.8 - *qgd - 1.5 - nc v ds =10v , i d =3.5a , v gs =4.5v body diode *v sd - 0.79 1.2 v v gs= 0v, i s =1.2a *trr - 5.7 - ns *qrr - 1.8 - nc i f =1.2a, v gs =0v, di f /dt=100a/ s *pulse test : pulse width 300 s, duty cycle 2% p-channel electrical characteristics (tc=25c, unless otherwise specified) symbol min. typ. max. unit test conditions static bv dss -20 - - v gs =0v, i d =-250 a v gs(th) -0.4 - -1.2 v v ds =v gs , i d =-250 a i gss - - 100 na v gs =8v, v ds =0v - - -1 v ds =-20v, v gs =0v i dss - - -10 a v ds =-16v, v gs =0v, tj=70 c - 60.1 85 v gs =-4.5v, i d =-2.5a *r ds(on) - 79.4 160 m v gs =-2.5v, i d =-2a *g fs - 5.9 - s v ds =-10v, i d =-3a dynamic ciss - 425 - coss - 59 - crss - 49 - pf v ds =-10v, v gs =0v, f=1mhz *td (on) - 3.6 - *tr - 19.4 - *td (off) - 38.6 - *tf - 4 - ns v ds =-10v, i d =-2.5a, v gs =-4.5v, r g =1 *qg - 6.3 - *qgs - 0.8 - *qgd - 1.6 - nc v ds =-10v, i d =-2a, v gs =-4.5v body diode *v sd - -0.84 -1.2 v v gs =0v, i s =-1.2a *trr - 5.8 - ns *qrr - 1.7 - nc i f =-1.2a, v gs =0v, di f /dt=100a/ s *pulse test : pulse width 300 s, duty cycle 2%
cystech electronics corp. spec. no. : c416n8j issued date : 2017.01.09 revised date : age no. : 4/13 MTC3585N8J cystek product specification recommended soldering footprint unit : mm
cystech electronics corp. spec. no. : c416n8j issued date : 2017.01.09 revised date : age no. : 5/13 MTC3585N8J cystek product specification typical characteristics : q1( n-channel ) typical output characteristics 0 5 10 15 20 25 30 012345 v ds , drain-source voltage(v) i d , drain current(a) 8v, 7v, 6v, 5v, 4v, 3v, 2.5v, 2v 1.5v brekdown voltage vs ambient temperature 0.4 0.6 0.8 1 1.2 1.4 -75 -50 -25 0 25 50 75 100 125 150 175 tj, junction temperature(c) bv dss , normalized drain-source breakdown voltage i d =250 a, v gs =0v static drain-source on-state resistance vs drain current 10 100 0.01 0.1 1 10 i d , drain current(a) r ds(on) , static drain-source on-state resistance(m) v gs =2.5 v v gs =4.5v v gs =2v reverse drain current vs source-drain voltage 0.2 0.4 0.6 0.8 1 1.2 024681 i dr , reverse drain current(a) v sd , source-drain voltage(v) 0 tj=25c tj=150c static drain-source on-state resistance vs gate-source voltage 0 50 100 150 200 012345678 v gs , gate-source voltage(v) r ds(on) , static drain-source on- state resistance(m) i d =3.5a drain-source on-state resistance vs junction tempearture 0.4 0.8 1.2 1.6 2 2.4 -75 -50 -25 0 25 50 75 100 125 150 175 tj, junction temperature(c) r ds(on) , normalized static drain- source on-state resistance v gs =4.5v, i d =2.5a r ds( on) @tj=25c : 20.5m typ. v gs =2.5v, i d =1.2a r ds( on) @tj=25c : 24.5m typ.
cystech electronics corp. spec. no. : c416n8j issued date : 2017.01.09 revised date : age no. : 6/13 MTC3585N8J cystek product specification typical characteristics(cont.) : q1( n-channel) capacitance vs drain-to-source voltage 10 100 1000 0 5 10 15 20 v ds , drain-source voltage(v) capacitance---(pf) c oss ciss crss threshold voltage vs junction tempearture 0.4 0.6 0.8 1 1.2 1.4 -75 -50 -25 0 25 50 75 100 125 150 175 tj, junction temperature(c) v gs(th) , normalized threshold voltage i d =250 a i d =1ma forward transfer admittance vs drain current 0.01 0.1 1 10 0.001 0.01 0.1 1 i d , drain current(a) g fs , forward transfer admittance(s) v ds =10v pulsed ta=25c gate charge characteristics 0 2 4 6 8 0246810121416 qg, total gate charge(nc) v gs , gate-source voltage(v) i d =3.5a i d =10v maximum safe operating area 0.01 0.1 1 10 100 0.01 0.1 1 10 100 1000 v ds , drain-source voltage(v) i d , drain current(a) dc 10ms 1ms 100 s r ds( on) limited t a =25c, tj=150c, v gs =4.5v r ja =84c/w,single pulse 1s 100m maximum drain current vs junction temperature 0 1 2 3 4 5 6 25 50 75 100 125 150 175 t j , junction temperature(c) i d , maximum drain current(a) t a =25c, v gs =4.5v r ja =84c/w
cystech electronics corp. spec. no. : c416n8j issued date : 2017.01.09 revised date : age no. : 7/13 MTC3585N8J cystek product specification typical characteristics(cont.) : q1( n-channel) typical transfer characteristics 0 5 10 15 20 25 30 012345 v gs , gate-source voltage(v) i d , drain current (a) v ds =5v single pulse power rating, junction to ambient (note on page 2) 0 10 20 30 40 50 0.001 0.01 0.1 1 10 100 pulse width(s) power (w) t j(max) =150c t a =25c r ja =84c/w transient thermal response curves 0.001 0.01 0.1 1 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 t 1 , square wave pulse duration(s) r(t), normalized effectivetransient thermal resistance single pulse 0.01 0.02 0.05 0.1 0.2 d=0.5 1.r ja (t)=r(t)*r ja 2.duty factor, d=t 1 /t 2 3.t jm -t a =p dm *r ja (t) 4.r ja =84 c/w
cystech electronics corp. spec. no. : c416n8j issued date : 2017.01.09 revised date : age no. : 8/13 MTC3585N8J cystek product specification typical characteristics : q2( p-channel) typical output characteristics 0 5 10 15 20 012345 -v ds , drain-source voltage(v) -i d , drain current (a) -8v, -7v, -6v, -5v,-4v,-3v v gs =-1.5v -2v -2.5v brekdown voltage vs ambient temperature 0.4 0.6 0.8 1 1.2 1.4 -75 -50 -25 0 25 50 75 100 125 150 175 tj, junction temperature(c) -bv dss , normalized drain-source breakdown voltage i d =-250 a, v gs =0v static drain-source on-state resistance vs drain current 10 100 1000 0.01 0.1 1 10 -i d , drain current(a) r ds(on) , static drain-source on-state resistance(m) v gs =-2.5v v gs =-2v v gs =-4.5v source drain current vs source-drain voltage 0.2 0.4 0.6 0.8 1 1.2 02468 -i s , source drain current(a) -v sd , source-drain voltage(v) 10 v gs =0v tj=25c tj=150c static drain-source on-state resistance vs gate-source voltage 0 50 100 150 200 012345678 -v gs , gate-source voltage(v) r ds(on) , static drain-source on-state resistance(m) i d =-2.5a drain-source on-state resistance vs junction tempearture 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 -75 -50 -25 0 25 50 75 100 125 150 175 200 tj, junction temperature(c) r ds(on) , normalized static drain-source on-state resistance v gs =-2.5v, i d =-2a r ds( on) @tj=25c : 79.4m v gs =-4.5v, i d =-2.5a r ds( on) @tj=25c : 60.1m
cystech electronics corp. spec. no. : c416n8j issued date : 2017.01.09 revised date : age no. : 9/13 MTC3585N8J cystek product specification typical characteristics(cont.) : q2(p-channel) capacitance vs drain-to-source voltage 10 100 1000 0 5 10 15 20 -v ds , drain-source voltage(v) capacitance---(pf) c oss ciss crss threshold voltage vs junction tempearture 0.4 0.6 0.8 1 1.2 1.4 -75 -50 -25 0 25 50 75 100 125 150 175 tj, junction temperature(c) -v gs(th) , normalized threshold voltage i d =-250 a i d =-1ma forward transfer admittance vs drain current 0.01 0.1 1 10 0.001 0.01 0.1 1 10 -i d , drain current(a) g fs , forward transfer admittance(s) v ds =-10v pulsed t a =25c gate charge characteristics 0 2 4 6 8 0246810121416 qg, total gate charge(nc) -v gs , gate-source voltage(v) i d =-2.5a v ds =-10v maximum safe operating area 0.01 0.1 1 10 100 0.01 0.1 1 10 100 1000 -i d , drain-source voltage(v) -i d , drain current(a) dc 10ms 100m 100 s t a =25c, tj=150c, v gs =-4.5v r ja =84c/w, single pulse 1s 1ms r ds( on) limited maximum drain current vs junction temperature 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 25 50 75 100 125 150 175 tj, junction temperature(c) -i d , maximum drain current(a) t a =25c, v gs =-4.5 v r ja =84c/w
cystech electronics corp. spec. no. : c416n8j issued date : 2017.01.09 revised date : age no. : 10/13 MTC3585N8J cystek product specification typical characteristics(cont.) : q2(p-channel) typical transfer characteristics 0 2 4 6 8 10 12 14 16 18 20 012345 -v gs , gate-source voltage(v) -i d , drain current (a) v ds =-5v single pulse power rating, junction to ambient (note on page 2) 0 10 20 30 40 50 0.001 0.01 0.1 1 10 100 pulse width(s) power (w) t j(max) =150c t a =25c r ja =84c/w transient thermal response curves 0.001 0.01 0.1 1 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 t 1 , square wave pulse duration(s) r(t), normalized effectivetransient thermal resistance single pulse 0.01 0.02 0.05 0.1 0.2 d=0.5 1.r ja (t)=r(t)*r ja 2.duty factor, d=t 1 /t 2 3.t jm -t a =p dm *r ja (t) 4.r ja =84 c/w
cystech electronics corp. spec. no. : c416n8j issued date : 2017.01.09 revised date : age no. : 11/13 MTC3585N8J cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c416n8j issued date : 2017.01.09 revised date : age no. : 12/13 MTC3585N8J cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of the package, measured on the package body surface.
cystech electronics corp. spec. no. : c416n8j issued date : 2017.01.09 revised date : age no. : 13/13 MTC3585N8J cystek product specification 2928-8j dimension marking: 8-lead 2928-8j plastic package cystek package code: n8j date code s1 g1 s2 g2 d1 d1 d2 d2 3585 millimeters inches millimeters inches dim min. max. min. max. dim min. max. min. max. a 0.935 1.100 0.0368 0.0433 e1 2.300 2.500 0.0906 0.0984 a1 0.010 0.100 0.0004 0.0039 e2 2.650 3.050 0.1043 0.1201 a2 0.925 1.000 0.0364 0.0394 e 0.65 bsc 0.0256 bsc b 0.250 0.400 0.0098 0.0157 l 0.300 0.600 0.0118 0.0236 c 0.100 0.200 0.0039 0.0079 0 8 0 8 d 2.950 3.100 0.1161 0.1220 1 7 typ 7 typ e 2.500 3.000 0.0984 0.1181 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing spec ification or packing method, please cont act your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .

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